As semiconductor manufacturing advances to finer process nodes, wafer-level defect analysis, failure location, and micro-nano fabrication have become key to improving yield. CIQTEK introduces the 8-inch Wafer Dual-Beam Full-Size Processing Solution, combining high-resolution imaging and precise ion beam processing to achieve "observation-analysis-cutting" across the entire wafer, providing strong technical support for advanced semiconductor processes.   This solution features a 150mm long-stroke high-precision sample stage, enabling full-wafer, non-destructive observation and processing of 8-inch wafers. With an external optical navigation system and intelligent anti-collision algorithms, it ensures rapid and precise wafer positioning and safe operation. The system is equipped with a Schottky field emission electron gun, offering a resolution of 0.9 nm @ 15kV, and an ion beam resolution of 3 nm @ 30kV, capable of defect detection, cross-section slicing, and micro-structure fabrication at the nanoscale.   Core Advantages: 150mm Travel Stage: Combines long travel with high precision for an extensive observation range. Excellent compatibility with different-sized fixtures. Robust structure ensures wafer stability and quick, reliable loading. 8-inch Quick Exchange: Intelligent weight-bearing design with a sliding base for stability and durability. Full-size compatibility: Supports 2/4/6/8-inch wafers. Fast sample exchange: Vacuum pumping and sample loading within one minute. Software and Anti-Collision: Fully automatic intelligent navigation with accurate movement and positioning. Multi-axis coordinated motion for full-wafer observation. Smart anti-collision: Trajectory simulation and algorithmic spatial calculations to avoid risks. Multiple real-time monitoring: Real-time multi-angle monitoring of wafer position. External Optical Navigation: Ultra-stable structure design suppresses image shake. High-definition imaging with a precise field of view for full-wafer display. Professional anti-glare lighting reduces wafer surface reflection.   Wafer observation range   CIQTEK Dual-Beam Electron Microscope Solution combines outstanding hardware with intelligent software systems, enabling efficient defect detection and process optimization through one-click brightness and contrast adjustment, auto-focus, and multi-format image output, empowering users to complete the full chain of tasks from defect discovery to process optimization.

In life sciences, achieving high-precision and large-scale 3D structural and dynamic analysis of biological samples such as cells and tissues has become key to breaking through research bottlenecks. CIQTEK has introduced a multi-technology-route Volumetric Electron Microscopy (VEM) solution, integrating SS-SEM, SBF-SEM, and FIB-SEM. This provides an all-around, high-performance, and intelligent platform for biological 3D reconstruction, helping researchers uncover the micro-level mysteries of life.   Three Advanced Technical Routes 01. SS-SEM High-Speed ImagingBy combining external serial sectioning with the CIQTEK high-speed HEM6000-Bio SEM, this solution enables rapid imaging and automated acquisition of large-volume samples. Data acquisition efficiency is more than 5× higher than conventional SEM, supporting 24/7 unattended high-throughput operation.   02. SBF-SEM In-Situ SectioningBased on the CIQTEK ultra-high-resolution SEM5000X with an integrated microtome, this approach achieves in-situ sectioning and imaging cycles. It offers simple operation, high automation, and effectively avoids surface contamination.   03. FIB-SEM High-Precision AnalysisLeveraging focused ion beam–electron beam dual-beam systems, this route delivers nanoscale Z-axis resolution to analyze fine structures such as organelles and membranes. It enables in-situ 3D reconstruction without physical slicing.   Intelligent Integration & Broad Applications The CIQTEK VEM solution deeply integrates AI algorithms and a multilingual software platform, supporting a full workflow from data acquisition, image alignment, and segmentation to 3D visualization. Compatible with mainstream reconstruction software, it significantly lowers the learning curve.   Application cases span neuroscience, cell biology, and pathogenic microbiology, offering a powerful tool for advancing life science research.

Research on the microscopic behavior of materials is entering a new era of multi-scenario coupling and in-situ dynamic characterization. CIQTEK has launched an innovative In-situ Mechanical Testing Solution, designed with outstanding openness and compatibility. It enables seamless integration of CIQTEK’s full range of electron microscopes with mainstream in-situ testing devices, providing a flexible and efficient platform for coupled analysis in diverse research scenarios.   Breaking the limitations of closed systems, the solution integrates all critical elements required for in-situ EM adaptability, featuring: High beam current: >100 nA, ideal for fast EDS/EBSD analysis Large space: 360 × 310 × 288 mm (L × W × H) High load capacity: 5 kg (up to 10 kg with custom fixtures) Multi-view CCDs: ensuring system safety during in-situ operation Multiple interfaces: supporting customized flange accessories Pre-acceptance: full accessory debugging before delivery, ensuring complete functionality without on-site installation issues The solution can be configured across CIQTEK’s full range of electron microscopy products, including CIQTEK SEM3200, SEM5000X, DB550 dual-beam systems, and more. It also offers seamless compatibility with tensile stages, heating stages, nanoindenters, and electrochemical workstations from world-leading suppliers. This open architecture enables researchers to flexibly combine the most suitable equipment, maximizing experimental performance.   CIQTEK’s in-situ stage solution supported customers in publishing a high-impact paper (DOI: 10.1126/science.adq6807).   CIQTEK’s In-situ Mechanical Solution also supports multi-field coupling (mechanical, thermal, electrochemical), enabling nanoscale real-time observation of materials under complex environments. By synchronizing high-resolution imaging with in-situ signals, researchers can capture critical phenomena such as crack propagation, phase transitions, and interfacial reactions with precision. With a temperature range of -170 to 1200 °C, advanced load control, and rapid response systems, it accurately simulates service conditions of materials across various industries. Combined with EBSD and EDS, it provides comprehensive datasets for understanding material behavior under coupled stimuli.   Successfully applied in aerospace materials, new energy devices, and biomedical materials, this solution demonstrates CIQTEK’s exceptional compatibility and scalability in advanced electron microscopy platforms.